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Posts Tagged ‘Thermal Paste’

INTEL Skylake De-lidded, Bad Wolf

It’s time to give ourselves a message through space and time so that we can head over to INTEL and save overclocking (Doctor Who reference for those who have no idea what I’m talking about). Maybe the dilemma isn’t that serious, but if a fuzzy photo is to be believed, then the Skylake processors might be continuing some of the overclocking problems from the past. KitGuru revlealed a shot of a de-lidded Skylake CPU and it looks like INTEL is going to keep using thermal compound instead of soldering. The photo is pretty fuzzy so it’s impossible to verify this claim. The other problem is we’re still a couple months out from the release of Skylake so there could be a couple of possible explanations for this that could be resolved by the time of the official releases. In case you don’t remember, INTEL began using thermal paste with both the i7-3770K and i7-4770K. Of course, overclockers justifiably pointed out that the thermal paste would not be as effective at heat transfer as a soldered lid. The thermal paste was slightly improved with the i7-4790K, but Skylake has already been provisioned to be a good overclocking CPU. Enthusiast hoped that at least the high-end chips would be soldered to the lid again in order to have the best thermal transfer, which would help unlock the highest overclocks. Take this all with a grain of salt for right now but at the moment, this doesn’t look very promising. Overall, this isn’t going to be...

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