Intel has demonstrated for the first time the successor to its low-power Atom chip. Moorestown will fuse the CPU and chipset together, and arrive in 2009 or 2010.

In his keynote today at the Intel Developer Forum in Taiwan, Intel's senior vice president and general manager of Intel's Ultra Mobility Group discussed how technology innovation and strong industry collaboration have driven the digital economy over the past 40 years, and the universal impact that the Internet and mobile Web has had in people's lives. "Technology innovation is the catalyst for new user experiences, industry collaborations and business models that together will shape the next 40 years," said Chandrasekher. "As the next billion people connect to and experience the Internet, significant opportunities lie in the power of technology and the development of purpose-built devices that deliver more targeted computing needs and experiences."

Chandrasekher cited the Intel® Atom™ processor, the upcoming "Nehalem" processor, and the Intel "Moorestown" platform scheduled for the 2009-2010 timeframe as prime examples of innovation and technology leadership. Also highlighted was the progress Intel is making in the Mobile Internet Devices (MID) market segment with the world's first working "Moorestown" platform demonstration.

Moorestown comprises of an SOC, codenamed "Lincroft," which integrates the 45nm processor, graphics, memory controller and video encode/decode onto a single chip and an I/O hub codenamed "Langwell", which supports a range of I/O ports to connect with wireless, storage, and display components in addition to incorporating several board level functions. Chandrasekher stated that Intel is on track to reduce Moorestown platform idle power by more than 10x compared to the first-generation MIDs based on the Intel Atom processor.