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Kingston HyperX T1 DDR3-1866

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Posted July 10, 2012 by Jake in RAM

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by Jake
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Specifications and Package

From Kingston: "Kingston’s KHX1866C9D3T1BK2/8GX is a kit of two 512M x 64-bit (4GB) DDR3-1866 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1866 at a low latency timing of 9-11-9 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications."

Below are the specifications:

  • JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
  • VDDQ = 1.5V (1.425V ~ 1.575V)
  • 667MHz fCK for 1333Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 9, 8, 7, 6
  • Posted CAS
  • Programmable Additive Latency: 0, CL – 2, or CL – 1 clock
  • Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
  • Bi-directional Differential Data Strobe
  • Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
  • Asynchronous Reset
  • PCB : Height 2.401” (61.00mm) w/ heat spreader, double sided component

And the XMP Parameters:

  • JEDEC: DDR3-1333 CL9-9-9 @1.5V
  • XMP Profile #1: D3-1866 CL9-11-9 @1.65V
  • XMP Profile #2: D3-1600 CL9-9-9 @1.65V

The packaging continues Kingston’s branding with the HyperX series. No fully sealed clamshell here, so you don’t need to destroy everything just to get at the modules.

Let’s take a closer look at the modules.

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