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HY810 and HY880 Compound Review

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Posted August 5, 2014 by Joe Kershner in Cooling

Overview

Hardware:
 
Manufacturer:
 
Release Date: Not available
 
Price at time of Review: Not available
 

WHAT WE LIKED:

Great performance with a high TDP CPU, low temperature, easy to apply
 

WHAT WE DISLIKED:

Compounds not available for sale at this time.
 
BOTTOM LINE:
The HY810 and 880 compounds offers extreme low temps with high TDP CPU's.
by Joe Kershner
Full Article
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Specifications

HY 810

Units Environment Test Method Test Result
Color No 25C Visual Grey
Thermal Conductivity W/m-K No ROCT8.140-82 >4.63
Thermal Impedance C -in2/W No ROCT8.140-82 <0.0087
Specific Gravity No 25C ASTM D1475 3.15
Evaporation % 150C/24 Hours Fed. Std. 791 0.001
Bleed % 150C/24 Hours Fed. Std. 791 0.05
Dielectric Constant No 100Hz ASTM D150 5.1
Viscosity No 25C NON
Thixotropic Index 1/10 mm 25C GB/T-269 380 -/+10
Moment Bared Temperature C No No -50 ~ 340C
Operation Temperature C No No -30 ~ 300C
Content
Silicone Compounds 15%
Carbon Compounds 35%
Metal Oxide Compounds 50%
Packaging Soft Mini bag Tube Canister
25g .5g 1g 1.5g .5g 1g 1.5g 10g 150g 1kg

HY 880

Units Environment Test Method Test Result
Color No 25C Visual Grey
Thermal Conductivity W/m-K No ROCT8.140-82 >5.15
Thermal Impedance C -in2/W No ROCT8.140-82 <0.004
Specific Gravity No 25C ASTM D1475 3.25
Evaporation % 150C/24 Hours Fed. Std. 791 0.001
Bleed % 150C/24 Hours Fed. Std. 791 0.05
Dielectric Constant No 100Hz ASTM D150 5.1
Viscosity No 25C NON
Thixotropic Index 1/10 mm 25C GB/T-269 380 -/+10
Moment Bared Temperature C No No -50 ~ 340C
Operation Temperature C No No -30 ~ 300C
Content
Silicone Compounds 10%
Carbon Compounds 45%
Metal Oxide Compounds 45%
Packaging Soft Mini bag Tube Canister
25g .5g 1g 1.5g .5g 1g 1.5g 30g 150g 1kg

*The product temperature, not spontaneous combustion, mining the general methods can be stored at room temperature.

Note: Stated Data Specifications were supplied by the manufacturer.

 

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