Cooler Master LGA1156 Heatsinks: Hyper 212 Plus & Hyper TX3
Hyper 212 Plus – Specs, Package
First off, the Cooler Master Hyper 212 Plus. It features Heatpipe Direct Touch (HDT) technology that we see popping up all over the place in CPU heatsinks. The Hyper 212 Plus is a tower-style design like all top performing coolers, but the HDT differs from "traditional" heatpipes in that these heatpipes directly touch the CPU instead of a plate. This should theoretically allow greater, more efficient heat transfer since the heatpipes do not have to be attached to a heat plate which can act as a barrier. This certainly has proven to be an innovative idea and seems a natural evolution of heatpipe technology.
The specifications for the Hyper 212 Plus are as follows:
- Model: RR-B10-212P-GP
Intel: Socket LGA1366, 1156, 775
AMD: Socket AM3, AM2, AM2+
- Dimension: 120 x 79.7 x 158.5 mm (L x W x H)
- Weight: 1.38 lbs (626g)
- Heat Sink Material: Aluminum fin
- Heat Pipes: 4 pcs
- Fan Dimension: 120 x 120 x 25 mm
- Fan Speed: 600 – 2000 R.P.M. (PWM)
- Fan Airflow: 21.2 – 76.8 CFM
- Air pressure (mmH2O): 0.40 – 3.90 mmH2O
- Bearing Type: Long life sleeve bearing
- Fan Life Expectancy: 40,000 hours
- Fan Noise Level (dB-A): 13 – 32 dBA
- Connector: 4-pin
The packaging of the cooler is your standard cardboard box. The colours of the box reflect Cooler Master’s corporate colours, white and purple. It looks good, and there is adequate information to let you know the basics about the product. When you open the box you will see that the cooler and fan are packed in a clear plastic clamshell-type casing. The accessories are straightforward, with a universal backplate that works with Intel 775, 1156, and 1366 brackets, as well as AMD AM2, AM2+, and AM3. There is also some thermal paste, fan clips, mounting hardware, fan, and an installation manual.
Here we see the packaging and contents of the Hyper 212 Plus:
Let’s take a closer look at the heatsink itself.