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Archive for December 18th, 2018

Another AMD Tease but Don’t Get Your Hopes Up

AMD teases are starting to become a bit of a joke. The last exciting release from them (for CPU enthusiasts) was the FX-8350. The chip made some good improvements on the previous Zambezi architecture, but after that things went downhill. Of course the FX-9590 was nothing more than a factory overclocked 8350. AMD announced they were done with the FX lineup. They refused to adopt Steamroller to the FX series. They announced FX but then said it wouldn’t come out til 2016 and finally, they teased an FX chip that was just a 9590 with a new liquid cooler even though they knew that AMD fans are wanting a new FX chip. So when AMD releases a video that says “Core is Back,” you can probably understand why we need to be slightly skeptical. With absolutely no official info, all we know is that there is an A series logo and a possible promotion image that shows 12 cores. At this point, the A series logo seems to negate the possibility of an FX refresh. If that’s the case, then it seems pretty confusing to put this much hype into an APU. While APUs can fill a very appropriate computing niche, they usually don’t make up the kind of material that deserves major hype build up. Enthusiasts would want to see something big so that should leave two options here. Either this is going to be a type of high end APU aimed more at the enthusiasts market, or this is a marketing gimmick to try and pick up sales for something that may not deserve it. This brings us to the ...



ADATA Launches XPG V3 DDR3 Overclocking Memory

ADATA Launches XPG V3 DDR3 Overclocking Memory Ready to Fire With XPG! Taipei, Taiwan – July 24, 2014 – ADATA® Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launches the latest XPG V3 series overclocking memory, running at a stellar 3100 megahertz. Its dual channel is designed to bring gamers and PC enthusiasts ultimate performance by Intel® Core™ fourth and fifth-generation processors and the latest Z97 platform.   The Thermal Conductive Technology for Great Heat Dissipation With speed up to 3100MHz and transfer bandwidth reaching 24.8GB/s, the XPG V3 series once again pushes gaming to the next level. It supports Extreme Memory Profile (XMP) version 1.3 and utilizes the Thermal Conductive Technology (TCT), which reduces the system temperature effectively. It enables every chip have contact with the heat sinks directly, ensuring IC and PCB operate in an environment of equal temperature for the best stability, even in full-speed operation.   No Crash with Great Stability  Thanks to the detachable fins extended upwards and 8-layer PCBs with 2oz copper, the XPG V3 series provides superior cooling performance and stable data transfer. The 2oz copper can greatly decrease electric resistance and consumes less power for higher efficiency. It also helps to improve the integrity of signal transfer by the lower EMI (ElectroMagnetic Interference), enabling overclockers to get excellent benchmarks in the circu...



HIS R7 260X and R7 250X Review

Today we're focusing on two cards from HIS, a company we're very familiar with, having seen many of their products in the past couple of generations in AMD cards. HIS typically produces cards with custom coolers and aggressive factory overclocks, but these two are a bit different. The R7 260X and R7 250X are budget-oriented cards for those with modest budgets and looking for some affordable gaming, and perhaps even something suitable for an HTPC setup.





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