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ENERMAX introduces a new down flow CPU cooler

Posted September 22, 2011 by Kevin in Cooling

ETD-T60 combines six Ø6mm heat pipes that cross from two sides of the heat sink with enhanced soldering technology to ensure flawless thermal conduction from CPU to heat sink. The fins of ETD-T60 series are added with ENERMAX’s unique VGF, VEF technology and Twister-bearing fan.

Furthermore, the ETD-T60 is attached with ENERMAX’s new patented AAP (Auto-Adjustable-Pressure) universal brackets. The AAP brackets support various CPU sockets and gives perfect contact force (18~28kgw) in between CPU and cooler. Thanks to AAP, the insufficient thermal conduction due to under-pressure or damage to CPU from over-pressure will no longer be an issue for users.

Genius design for best cooling performance

VGF (Vortex Generator Flow, patented):
Small Vortex Generators applied around the heat pipes that makes air go through the
windless area behind the heat pipes of 55 fins to maximize air convection and remove
heat that conventional designs cannot reach.
VEF (Vacuum Effect Flow):

The unique design on the heat sink creates an air channel with the fin flaps. That
makes more cool air sucked in by utilizing the differential pressure in between the heat
sink’s internal and external air temperature.
AAP (Auto-Adjustable-Pressure, patented):
Inside the bracket’s pillars, ENERMAX integrates Auto-Adjustable-Pressure
mechanism giving perfect contact force between CPU and cooler. It reduces the risk
of insufficient cooling performance caused by improper installation.
ENERMAX’s ETD-T60 CPU Cooler series includes two models with different fan designs.



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