Pure Overclock – Computer Hardware News, Reviews and More

 
 
 
 
 

A-Data Introduces XPG Gaming Series DDR3-2000G for Today’s Gaming Market

Comments Off on A-Data Introduces XPG Gaming Series DDR3-2000G for Today’s Gaming Market
Posted May 24, 2010 by jeremy in News

Designed for favorite gaming and daily computing groups on Intel X58, P55, and H55 platform, the new XPG Gaming Series DDR3-2000G DRAM module is promised to deliver CL9-9-9-24 timing with 1.65V voltage.


A-DATA is the leader in the reliable and high performance DRAM module,
said Richard Shen, manager of A-DATA product management department.
Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can rely on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.

Gallery:
Highslide JS

Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module:

  • All DRAM IC are verified by high standard criteria.
  • High quality 8 layers PCB (Printed Circuit Board).
  • Equipped aluminum heat spreaders to perform heat away from DRAM module.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module:

  • All DRAM IC are verified by high standard criteria.
  • High quality 2oz copper 8 layers PCB (Printed Circuit Board):
  • Assist spreading of heat from critical areas to perform effective thermal cooling.
  • Decrease the resistance of electronic flow to avoid electric waste.
  • Increase DRAM module’s lifetime.
  • Improve signal integrity.
  • Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
  • Thermal Conductive Technology (TCT) – Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
  • Feature Extreme Memory Profiles.
  • Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
  • Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
  • Optimized for 64-bit OS (operating system).
  • Test at latency settings 9-9-9-24 at 1.55V-1.75V.
  • SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
  • Limited lifetime Warranty.


Find us on Google+