Archive for February 20th, 2019
Flash memory manufacturer leader, Silicon Power debut their flagship USB flash drive earlier this year, the LuxMini 920. To continue its success, Silicon Power announced today, the LuxMini 920 storage capacity will be boosted up to 64GB.
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height.
LaCie today announced the LaCie Network Space 2, design by Neil Poulton - a leading-edge Network Attached Storage (NAS) and media server. The LaCie Network Space 2 combines the performance of a full-featured NAS solution, with a unique and customised way to manage the total experience.
ECS revealed leading technology called "15μ Gold Contact" that ensures motherboards longest lifespan, better reliability and excellent contact. This leading Technology is available on both Intel and AMD platforms.
Super Talent Technology, a leading manufacturer of Flash storage solutions and DRAM memory modules, today announced the new SuperSpeed USB 3.0 RAIDDrive, which supports transfer speeds up to ten times faster than USB 2.0 drives. The new drive, in 32GB, 64GB and 128GB capacities, is fully backward compatible with USB 2.0 ports, but operates at slower speeds.
The Mushkin Enhanced Design Team has once again pushed the envelope in regards to memory cooling and developed the new Copperhead Memory Cooling System. The side plates are comprised of pure copper, providing much more heat reduction than other metals.
We just published our latest review, but what's happening in the rest of the tech world? Our Daily Sampler looks at Graphics Cards, Motherboards and Chipsets, Cooling and Cases, and Consumer Electronics.
Will the new stepping bring more overclocking headroom?
A monster unit for those who demand premium performance.