OCZ roll-out HydroFlow HF-MK1 CPU waterblock
The HydroFlow HF-MK1 targets the highest possible thermal exchange rate between a solid body and the surrounding fluid, while maintaining enough cross sectional area for superior thermal conductance within the fin structure,? commented Dr. Michael Schuette, V.P. of Technology Development at OCZ Technology. “Additionally, the relieved contact area concentrates the pressure on the actual die area of any processor, thereby minimizing the thermal interface material-induced loss in heat dissipation. In short, the HydroFlow epitomizes the recent advances in fluid cooling at an affordable price.?
The triangular fins in the HF-MK1 provide the highest volume to surface ratio of any geometric shape for best dissipation possible, and this special design also creates sufficient turbulence to eliminate the ?skin? effect caused by laminar flow. The base block of the HydroFlow increases center contact with the processor core for the greatest possible cooling potential, ensuring maximum exchange and functionality between the waterblock and CPU.