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Defective notebook GPU’s named, faults detailed

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Posted July 6, 2008 by admin in News

With Nvidia indicating that the problem is due to the packaging material used with some of its chips, which was compounded by the thermal design of some notebooks, industry sources in Taiwan believe the problem is most likely related to either the solder bumping process used by one (or more) of Nvidia’s manufacturing partners or the company’s PCB substrate supplier(s).

Sources at foreign institutional investors in Taiwan indicated that the defective products were Nvidia Geforce 8500M-series graphics chips launched in 2007, and that the problem was caused by related bump processing. Taiwan Semiconductor Manufacturing Company (TSMC), Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industrial (SPIL) all provide bump processing services to Nvidia.

When ask for comment by Digitimes TSMC declined citing client confidentiality, while ASE and SPIL both claimed to know nothing about the issue because the defective chips are older generation products.



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