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Nvidia prepare 55nm GT200 die shrink

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Posted May 31, 2008 by admin in News

There are several problems with the GT200, most of which are near fatal. The first is the die size, 576mm^2, bigger than most Itanics. One might trust Intel to make a chip that big with decent yields, especially if it is basically an island of logic in the middle of a sea of cache. Nvidia using a foundry process doesn’t have a chance of pulling this off.

Word has come out of Satan Clara that the yields are laughable. No, make that abysmal, they are 40 per cent. To add insult to injury, that 40 per cent includes both the 280 and the 260 yield salvage parts. With about 100 die candidates per wafer, that means 40 good dice per wafer. Doing the maths, a TSMC 300mm 65nm wafer runs about $5000, so that means each good die costs $125 before packaging, testing and the like. If they can get away with sub-$150 costs per GPU, we will be impressed.

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