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Microsoft prepare Xbox 360 GPU shrink

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Posted May 9, 2008 by admin in Consoles

TSMC will produce the 65nm chips, ASE will package and test them, and Nanya will supply the flip-chip packaging substrates. Microsoft has supposedly booked a production capacity at TSMC estimated to be at around 10,000 300mm wafers.

Inventory of the existing Falcon chips are reportedly depleted, paving the way for the transition to Jasper. The next step for the Xbox 360 console is dubbed ?Valhalla,? which will integrate both the GPU and CPU in a single package as a cost-cutting measure, isn?t expected until a year after Jasper.



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