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DDR3 prices set to fall within 10% of DDR2

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Posted January 25, 2008 by admin in News

In the memory backend production sector, Taiwan packaging and testing houses are also ready for the memory standard migration. In the packaging segment, backend production houses do not have to upgrade their equipment as both DDR2 and DDR3 are packed in fine pitch ball-grid array (FBGA) form. In the memory testing segment, Powertech Technology (PTI) is acting the most aggressive among Taiwan testing houses in its move to support DDR3. In order to meet the demand of key customer Elpida Memory, PTI has already purchased three testers from Verigy with shipments in small volume already underway.

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