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Fusion: a multi-chip package?

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Posted July 28, 2007 by admin in CPU & Motherboards

It’s believed that one die will feature the microprocessor, memory controller and HyperTransport, while the remaining one will accommodate the GPU – all connected by “AMD’s own tech.” Fusion isn’t the only multi-chip module to come from AMD either, Montreal is two Shanghai dies on Socket F/AM3.

Fusion’s CPU will be reportedly manufactured by AMD’s Fab36 and Chartered Semiconductor, leaving the GPU in the hands of foundry TSMC (Taiwan Semiconductor Manufacturing Company).

When it comes to the future, it is obvious that AMD will want to create a monolithic die with both CPU and GPU part glued together, but with 45 nanometre and 55 nanometre manufacturing processes being a reality in 2008, first generation will have to be multi-chip module packed.



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